Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep
all traces as short as possible and to maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the
MAX5927A/MAX5929AMAX5929D close to the cards
connector. Use a ground plane to minimize impedance
and inductance. Minimize the current-sense resistor
trace length (<10mm), and ensure accurate current
sensing with Kelvin connections (Figure 13).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the topside of the board.
Low-Voltage, Quad, Hot-Swap
Controllers/Power Sequencers
22 _______________________________________________________________________ ________________________________________________ __________________________________ ___________________
MAX5927A
MAX5929AMAX5929D
GND
Q4
Q3
Q2
Q1
V
1
ON1
ON2
ON3
ON4
GND
ON1
OUT1
OUT2
*MAX5927A ONLY.
**OPTIONAL COMPONENT.
OUT3
OUT4
1nF
16V
STAT1
STAT2
STAT3
STAT4
ON2
ON3
ON4
REMOVABLE CARD
BACKPLANE
V
2
V
3
V
4
R
SENSE1
R
SENSE2
R
SENSE3
R
SENSE4
R
LIM1
**
R
LIM2
**
R
LIM3
**
R
LIM4
**
R
LIM
**
Typical Operating Circuit
Figure 13. Kelvin Connection for the Current-Sense Resistors
SENSE RESISTOR
HIGH-CURRENT PATH
MAX5927A
MAX5929AMAX5929D
发布紧急采购，3分钟左右您将得到回复。
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